Thin film forming apparatus, thin film forming method, and shield component
US9194038B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 21, 2010 |
| Grant date | Nov 24, 2015 |
| Priority date | — |
| Expiry date | Jul 29, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/0268
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The inventors of this invention conducted a test and found out that to prevent peel-off of an adherent film, it is not of essential importance to set the radius of curvature equal to or larger than a predetermined threshold. The inventors of the present invention also found out that peel-off of an adherent film occurs in the region in which the curvature of a shield changes and is less likely to occur when the change in curvature of the shield is small. Accordingly, the key to the problem is the magnitude of a change in curvature of the shield, so changing the curvature stepwise makes it possible to suppress a large change in curvature, and thus to prevent peel-off of an adherent film free from any disadvantages such as deterioration in film thickness distribution, which may occur due to an increase in size of the shield.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.