Semiconductor device having power distribution using bond wires
US9196598B1 · kind B1 · utility
1Cited by
15References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 12, 2014 |
| Grant date | Nov 24, 2015 |
| Priority date | — |
| Expiry date | Jun 12, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30101
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device uses insulated bond wires to connect peripheral power supply and ground bond pads on the periphery of the device to array power supply and ground bond pads located on an interior region of a integrated circuit die of the device. Power supply and ground voltages are conveyed from array bond pads using vertical vias down to one or more corresponding inner power distribution layers. The bond wire connections form rows and columns of hops constituting a mesh power grid that reduces the IR drop of the semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.