Millimeter-wave radio frequency integrated circuit packages with integrated antennas
US9196951B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 26, 2012 |
| Grant date | Nov 24, 2015 |
| Priority date | — |
| Expiry date | Dec 19, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49016
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A package structure includes a planar core structure, an antenna structure disposed on one side of the planar core structure, and an interface structure disposed on an opposite side of the planar core structure. The antenna structure and interface structure are each formed of a plurality of laminated layers, each laminated layer having a patterned conductive layer formed on an insulating layer. The antenna structure includes a planar antenna formed on one or more patterned conductive layers of the laminated layers. The interface structure includes a power plane, a ground plane, signal lines, and contact pads formed on one or more patterned conductive layers of the laminated layers of the interface structure. The package structure further includes an antenna feed line structure formed in, and routed through, the interface structure and the planar core structure, and connected to the planar antenna.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.