Method of hermetically sealing a hole with a fuse material
US9199839B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Nov 24, 2014 |
| Grant date | Dec 1, 2015 |
| Priority date | — |
| Expiry date | Nov 24, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/0145
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
Method of hermetically sealing a hole with a fuse material, comprising the following steps: applying a portion of wettable material onto a surface such that it completely surrounds the hole made through said surface and is located outside the hole, or completely surrounds a first part of said surface corresponding to a location of the hole; applying a portion of fuse material on the portion of wettable material and on a second part of said surface located around the portion of wettable material; reflowing the portion of fuse material to form a bump of fuse material which has a shape corresponding to a part of a sphere, which is fastened only to the portion of wettable material and which hermetically plugs the hole; wherein the hole is made in said surface before reflowing the portion of fuse material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.