Arnoldus Den Dekker
6Patents
2h-index
19Co-inventors
44Inventor score
Filing activity: May 3, 2005 → Nov 24, 2014
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8138087B2 | Method of manufacturing an integrated circuit | Electricity | 6 | Active |
| US9908773B2 | Method for packaging a microelectronic device in a hermetically sealed cavity and managing the atmosphere of the cavity with a dedicated hole | Performing Operations; Transporting | 2 | Active |
| US8282845B2 | Etching with improved control of critical feature dimensions at the bottom of thick layers | Performing Operations; Transporting | 0 | Active |
| US8901703B2 | Electronic device | Electricity | 0 | Expired |
| US10532924B2 | Packaging structure of a microelectronic device having a hermeticity improved by a diffusion barrier layer | Performing Operations; Transporting | 0 | Active |
| US9199839B2 | Method of hermetically sealing a hole with a fuse material | Performing Operations; Transporting | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.