Water-rich stripping and cleaning formulation and method for using same
US9201308B2 · kind B2 · utility
1Cited by
20References
20Claims
0Family size
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Key dates
| Filing date | Jul 8, 2013 |
| Grant date | Dec 1, 2015 |
| Priority date | — |
| Expiry date | Feb 19, 2034 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/22
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present invention relates to water-rich formulations and the method using same, to remove bulk photoresists, post-etched and post-ashed residues, residues from Al back-end-of-the-line interconnect structures, as well as contaminations. The formulation comprises: hydroxylamine; corrosion inhibitor containing a mixture of alkyl dihydroxybenzene and hydroxyquinoline; an alkanolamine, a water-soluble solvent or the combination of the two; and at least 50% by weight of water.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.