Integrated circuit packaging system with pattern-through-mold and method of manufacture thereof
US9202742B1 · kind B1 · utility
11Cited by
6References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 15, 2014 |
| Grant date | Dec 1, 2015 |
| Priority date | — |
| Expiry date | Jan 15, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit packaging system, and a method of manufacture thereof, including: a substrate; a device attached on a top surface of the substrate; a mold encapsulating the device, the mold having a through via and a recessed pattern characterized by being formed in a single process; and a conductive via in the through via and a conductive pattern in the recessed pattern characterized by being formed in another single process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.