Power module package and method for manufacturing the same
US9202798B2 · kind B2 · utility
2Cited by
7References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 18, 2013 |
| Grant date | Dec 1, 2015 |
| Priority date | — |
| Expiry date | Mar 18, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10962
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed herein is a power module package including an external connection terminal; a substrate in which a fastening unit allowing one end of the external connection terminal to be insertedly fastened thereinto is buried at a predetermined depth in a thickness direction; and a semiconductor chip mounted on one surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.