Hermetically sealed electronic device using solder bonding
US9205505B2 · kind B2 · utility
7Cited by
10References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 22, 2011 |
| Grant date | Dec 8, 2015 |
| Priority date | — |
| Expiry date | Jul 16, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1062
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Solder can be used to wet and bind glass substrates together to ensure a hermetic seal that superior (less penetrable) than conventional polymeric (thermoplastic or thermoplastic elastomer) seals in electric and electronic applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.