Method and apparatus for surface processing of a substrate using an energetic particle beam
US9206500B2 · kind B2 · utility
3Cited by
22References
20Claims
0Family size
Inventors
Key dates
| Filing date | Sep 18, 2008 |
| Grant date | Dec 8, 2015 |
| Priority date | — |
| Expiry date | Nov 4, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/3146
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Method and apparatus for processing a substrate with an energetic particle beam. Features on the substrate are oriented relative to the energetic particle beam and the substrate is scanned through the energetic particle beam. The substrate is periodically indexed about its azimuthal axis of symmetry, while shielded from exposure to the energetic particle beam, to reorient the features relative to the major dimension of the beam.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.