Direct liquid-contact micro-channel heat transfer devices, methods of temperature control for semiconductive devices, and processes of forming same

US9207274B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Christopher R. Schroeder · Gilbert, US
• Christopher Wade Ackerman · Phoenix, US
• James C. Shipley · Gilbert, US
• Tolga Acikalin · Chandler, US
• Ioan Sauciuc · Phoenix, US
• Michael Rutigliano · Chandler, US
• James G. Maveety · San Jose, US
• Ashish Gupta · San Jose, US

Key dates

• Filing date: Nov 6, 2009
• Grant date: Dec 8, 2015
• Expiry date: Jul 14, 2032

Classification

• Technology area (CPC —): General

Abstract

An apparatus to test a semiconductive device includes a base plane that holds at least one heat-transfer fluid unit cell. The at least one heat-transfer fluid unit cell includes a fluid supply structure including a supply-orifice cross section as well as a fluid return structure including a return-orifice cross section. The supply-orifice cross section is greater than the return-orifice cross section. A die interface is also included to be a liquid-impermeable material.