Power module package with a fastening unit including a non-conductive portion
US9209114B2 · kind B2 · utility
4Cited by
7References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 18, 2013 |
| Grant date | Dec 8, 2015 |
| Priority date | — |
| Expiry date | Mar 18, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed herein is a power module package including an external connection terminal, a substrate in which a fastening unit allowing one end of the external connection terminal to be insertedly fastened thereinto is formed to penetrate in a thickness direction thereof, and a semiconductor chip mounted on one surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.