Patent · US Active

Double-sided package

US9209121B2 · kind B2 · utility

3Cited by

10References

30Claims

0Family size

Assignee

Analog Devices, Inc. · US

Inventors

Thomas M. Goida · Windham, US
Xiaojie Xue · Bedford, US

Key dates

Filing date	Feb 1, 2013
Grant date	Dec 8, 2015
Priority date	—
Expiry date	Feb 20, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Various embodiments of an integrated device package are disclosed herein. The package may include a leadframe having a first side and a second side opposite the first side. The leadframe can include a plurality of leads surrounding a die mounting region. A first package lid may be mounted on the first side of the leadframe to form a first cavity, and a first integrated device die may be mounted on the first side of the leadframe within the first cavity. A second integrated device die can be mounted on the second side of the leadframe. At least one lead of the plurality of leads can provide electrical communication between the first integrated device die and the second integrated device die.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.