Self-aligned wrapped-around structure
US9209247B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 10, 2013 |
| Grant date | Dec 8, 2015 |
| Priority date | — |
| Expiry date | Dec 13, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D64/518
Abstract
An embodiment vertical wrapped-around structure and method of making. An embodiment method of making a self-aligned vertical structure-all-around device including forming a spacer around an exposed portion of a semiconductor column projecting from a structure layer, forming a photoresist over a protected portion of the structure layer and a first portion of the spacer, etching away an unprotected portion of the structure layer disposed outside a periphery collectively defined by the spacer and the photoresist to form a structure having a footer portion and a non-footer portion, the non-footer portion and the footer portion collectively encircling the semiconductor column, and removing the photoresist and the spacer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.