Optoelectronic semiconductor component

US9209328B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Karl Weidner · Birkenfeld, DE
• Ralph Wirth · Lappersdorf, DE
• Axel Kaltenbacher · Ingolstadt, DE
• Walter Wegleiter · Nittendorf, DE
• Bernd Barchmann · Regensburg, DE
• Oliver Wutz · Regensburg, DE
• Jan Marfeld · Regensburg, DE

Key dates

• Filing date: Mar 24, 2014
• Grant date: Dec 8, 2015
• Expiry date: Mar 24, 2034

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/853
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having side areas covered by a shaped body, at least one plated-through hole including an electrically conductive material, and an electrically conductive connection electrically conductively connected to the semiconductor chip and the plated-through hole, wherein, the plated-through hole is arranged in a manner laterally spaced apart from the semiconductor chip, the plated-through hole completely penetrates through the shaped body, and the plated-through hole extends from a top side of the shaped body to an underside of the shaped body, the electrically conductive connection extends at the top side of the shaped body.