Separable and integrated heat sinks facilitating cooling multi-compnent electronic assembly
US9210831B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 15, 2013 |
| Grant date | Dec 8, 2015 |
| Priority date | — |
| Expiry date | Jan 29, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49359
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Cooling apparatuses are provided which facilitate cooling a multi-component assembly, such as a hub module assembly. The cooling apparatus includes a first liquid-cooled heat sink configured to facilitate removal of heat generated by one or more first electronic components of the multi-component assembly, and a second liquid-cooled heat sink configured to facilitate removal of heat generated by one or more second electronic components of the multi-component assembly. The first liquid-cooled heat sink is separably coupled to the multi-component assembly, and the second liquid-cooled heat sink is fixedly secured to the multi-component assembly. Fluid couplers fluidically couple the first and second liquid-cooled heat sinks to facilitate liquid coolant flow through the fixedly-secured, second liquid-cooled heat sink from the separably-coupled, first liquid-cooled heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.