Eric J. McKeever
47Patents
7h-index
29Co-inventors
65Inventor score
Filing activity: Sep 29, 2008 → Feb 28, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8922998B2 | Coolant manifold with separately rotatable manifold section(s) | Emerging Cross-Sectional Technologies | 20 | Active |
| US9453972B1 | Pluggable module for heat removal device | Electricity | 15 | Active |
| US9009968B2 | Coolant manifold with separately rotatable manifold section(s) | Emerging Cross-Sectional Technologies | 14 | Active |
| US9490188B2 | Compute intensive module packaging | Electricity | 13 | Active |
| US9504184B2 | Flexible coolant manifold-heat sink assembly | Electricity | 12 | Active |
| US9913403B2 | Flexible coolant manifold—heat sink assembly | Electricity | 11 | Active |
| US9210831B2 | Separable and integrated heat sinks facilitating cooling multi-compnent electronic assembly | Emerging Cross-Sectional Technologies | 9 | Active |
| US9341418B2 | Thermal transfer structure with in-plane tube lengths and out-of-plane tube bend(s) | Emerging Cross-Sectional Technologies | 7 | Active |
| US9298231B2 | Methods of fabricating a coolant-cooled electronic assembly | Emerging Cross-Sectional Technologies | 7 | Active |
| US9265176B2 | Multi-component electronic module with integral coolant-cooling | Electricity | 6 | Active |
| US9647762B2 | Integrated parallel optical transceiver | Physics | 6 | Active |
| US9496194B2 | Customized module lid | Electricity | 6 | Active |
| US9497888B2 | Thermal transfer structure(s) and attachment mechanism(s) facilitating cooling of electronics card(s) | Emerging Cross-Sectional Technologies | 6 | Active |
| US9258925B2 | Selective clamping of electronics card to coolant-cooled structure | Emerging Cross-Sectional Technologies | 6 | Active |
| US10111364B2 | Coupling assemblies for connecting fluid-carrying components | Mechanical Engineering; Lighting; Heating | 5 | Active |
| US9144178B2 | Selective clamping of electronics card to coolant-cooled structure | Emerging Cross-Sectional Technologies | 5 | Active |
| US9726829B2 | Blind mating strain relieved optical fiber connector | Physics | 4 | Active |
| US9494763B2 | Optical fiber routing mat | Physics | 4 | Active |
| US9265178B2 | Thermal transfer and coolant-cooled structures facilitating cooling of electronics card(s) | Emerging Cross-Sectional Technologies | 4 | Active |
| US10385996B2 | Tapering couplers for connecting fluid flow components | Electricity | 3 | Active |
| US9720184B2 | Blind mating strain relieved optical fiber connector | Physics | 3 | Active |
| US9456527B2 | Fabricating separable and integrated heat sinks facilitating cooling multi-component electronic assembly | Emerging Cross-Sectional Technologies | 3 | Active |
| US9661784B2 | Multi-component electronic module with integral coolant-cooling | Electricity | 3 | Active |
| US10024606B2 | Fabricating thermal transfer structure with in-plane tube lengths and out-of-plane tube bend(s) | Emerging Cross-Sectional Technologies | 3 | Active |
| US9818667B2 | Compute intensive module packaging | Electricity | 2 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.