Systems and methods for laser splitting and device layer transfer
US9214353B2 · kind B2 · utility
16Cited by
6References
8Claims
0Family size
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Key dates
| Filing date | Feb 26, 2013 |
| Grant date | Dec 15, 2015 |
| Priority date | — |
| Expiry date | Feb 26, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/547
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Methods and systems are provided for the split and separation of a layer of desired thickness of crystalline semiconductor material containing optical, photovoltaic, electronic, micro-electro-mechanical system (MEMS), or optoelectronic devices, from a thicker donor wafer using laser irradiation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.