Semiconductor devices including air gap spacers
US9214382B2 · kind B2 · utility
12Cited by
5References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 29, 2014 |
| Grant date | Dec 15, 2015 |
| Priority date | — |
| Expiry date | Jun 4, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10B12/485
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A spacer covering a sidewall of a contact plug includes a relatively more damaged first portion and a relatively less damaged second portion. An interface of the first and second portions of the spacer is spaced apart from a metal silicide layer of the contact plug. Thus reliability of the semiconductor device may be improved. Related fabrication methods are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.