Method for preventing die pad delamination
US9214440B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 17, 2014 |
| Grant date | Dec 15, 2015 |
| Priority date | — |
| Expiry date | Dec 17, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/35121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention is directed to a method for inhibiting or preventing delamination at the interface of the die attach/mold compound and the die pad of a semiconductor device and a semiconductor device formed by such method. The method includes providing a leadframe having a top surface; coating said top surface of said leadframe with first and second silane coating; heating said silane coatings to form a sol-gel layer having a porosity of at least 10%; applying a die to said sol-gel layer; securing said die to said sol-gel layer by a die attaching compound; and after the curing of die attach material and wire bonding, a mold compound is applied through molding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.