Patent · US Active

Inspection arrangement

US9217633B2 · kind B2 · utility

0Cited by

6References

12Claims

0Family size

Assignee

HSEB Dresden GmbH · DE

Inventors

Bernd Srocka · Berlin, DE
Ralf Langhans · Dresden, DE

Key dates

Filing date	Apr 5, 2013
Grant date	Dec 22, 2015
Priority date	—
Expiry date	Apr 5, 2033

Classification

Technology area (CPC G)Physics
CPC primaryG01N2201/062
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

The invention relates to an arrangement for analyzing an at least partially reflective surface of a wafer or other objects, containing a holder for holding the object; an inspection arrangement arranged at a distance in the region in front of the surface to be analyzed; and a measurement arrangement for determining the distance and/or inclination of the surface for the inspection arrangement; characterized be a radiation source, the radiation of which is directed towards the surface to be analyzed at an angle; and a spatially resolving detector for receiving the radiation from the radiation source that is reflected from the surface to be analyzed, wherein the radiation source and the detector are arranged outside the region necessary for the inspection between the inspection arrangement and the surface to be analyzed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.