Three-direction alignment mark
US9217917B2 · kind B2 · utility
0Cited by
6References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 27, 2014 |
| Grant date | Dec 22, 2015 |
| Priority date | — |
| Expiry date | Apr 12, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a first material formed on a substrate. The first material includes a first alignment mark. The first alignment mark includes alignment lines in at least three directions. The semiconductor device further includes a second material comprising a second alignment mark. The second alignment mark corresponds to the first alignment mark such that when the second alignment mark is aligned with the first alignment mark, the second material is aligned with the first material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.