I-I Cheng
10Patents
2h-index
15Co-inventors
43Inventor score
Filing activity: Apr 24, 2012 → Jan 14, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9640456B2 | Support structure for integrated circuitry | Electricity | 4 | Active |
| US10056426B2 | Apparatus and method for fabricating a light guiding grid | Physics | 4 | Active |
| US10340301B2 | Support structure for integrated circuitry | Electricity | 2 | Active |
| US8872301B2 | Dual profile shallow trench isolation apparatus and system | Electricity | 2 | Active |
| US8884390B2 | Backside illumination image sensor chips and methods for forming the same | Electricity | 1 | Active |
| US9142588B2 | Backside illumination image sensor chips and methods for forming the same | Electricity | 1 | Active |
| US9450014B2 | Backside illumination image sensor chips and methods for forming the same | Electricity | 0 | Active |
| US11177306B2 | Support structure for integrated circuitry | Electricity | 0 | Active |
| US9217917B2 | Three-direction alignment mark | Electricity | 0 | Active |
| US10535694B2 | Support structure for integrated circuitry | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.