Semiconductor device carrier and semiconductor package using the same
US9219027B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 20, 2014 |
| Grant date | Dec 22, 2015 |
| Priority date | — |
| Expiry date | Feb 20, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The semiconductor device carrier comprises a conductive carrier, a dielectric layer, a conductive trace layer, a conductive stud layer and the plating conductive layer. The conductive carrier comprises at least one cavity. The dielectric layer has a first dielectric surface and a second dielectric surface opposite the first dielectric surface. The conductive trace layer disposes in the dielectric layer and is exposed on the second dielectric surface. The conductive stud layer disposes in the dielectric layer and is exposed on the first dielectric surface, wherein the conductive stud layer is electrically connected to the conductive trace layer. The plating conductive layer is disposed on the first dielectric surface and the exposed conductive stud layer. The cavity exposes the conductive trace layer and the dielectric layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.