Apparatus and method for stripping solder metals during the recycling of waste electrical and electronic equipment
US9221114B2 · kind B2 · utility
18Cited by
73References
88Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 13, 2012 |
| Grant date | Dec 29, 2015 |
| Priority date | — |
| Expiry date | Dec 13, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02W30/82
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Apparatuses and processes for recycling printed wire boards, wherein electronic components, precious metals and base metals may be collected for reuse and recycling. The apparatuses generally include a mechanical solder removal module and/or a thermal module, a chemical solder removal module, and a precious metal leaching module, wherein the modules are attached for continuous passage of the e-waste from module to module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.