Non-permeable substrate carrier for electroplating

US9222193B2 · kind B2 · utility

Assignee

• SUNPOWER CORPORATION · US

Inventors

• Emmanuel Chua Abas · Calasiao, PH
• Chen-An Chen · Sunnyvale, US
• Diana Xiaobing Ma · Saratoga, US
• Kalyana Bhargava Ganti · Fremont, US
• Edmundo Anida Divino · Cavite, PH
• Jake Randal G. Ermita · Pagsanjan, PH
• Jose Francisco Capulong · Lucena, PH
• Arnold Villamor Castillo · Cuenca, PH

Key dates

• Filing date: Oct 26, 2012
• Grant date: Dec 29, 2015
• Expiry date: Oct 11, 2033

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T156/1057
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier comprises a non-conductive carrier body on which the substrates are to be held. Electrically-conductive lines are embedded within the carrier body, and a plurality of contact clips are coupled to the electrically-conductive lines embedded within the carrier body. The contact clips hold the substrates in place and electrically couple the substrates to the electrically-conductive lines. The non-conductive carrier body is continuous so as to be impermeable to flow of electroplating solution through the non-conductive carrier body. Other embodiments, aspects and features are also disclosed.