Method of automatic fluid dispensing for imprint lithography processes
US9223202B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 9, 2007 |
| Grant date | Dec 29, 2015 |
| Priority date | — |
| Expiry date | May 28, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1461
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Disclosed herein is an automatic fluid dispensing method and system for dispensing fluid on the surface of a plate-like material, or substrate, including a semiconductor wafer for imprint lithography processes. The dispensing method uses fluid dispenser and a substrate stage that may generate relative lateral motions between a fluid dispenser tip a substrate. Also described herein are methods and devices for creating a planar surface on a substrate using a substantially unpatterned planar template.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.