Semiconductor apparatus capable of detecting whether pad and bump are stacked
US9224722B2 · kind B2 · utility
2Cited by
1References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 30, 2014 |
| Grant date | Dec 29, 2015 |
| Priority date | — |
| Expiry date | Apr 30, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15192
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor apparatus may include a semiconductor chip, and the semiconductor chip may include a first pad, a second pad, and a bump. The first pad may be configured to receive a signal from an external device, and the second pad may include first and second metal layers electrically isolated from each other. The bump may be stacked over the second pad, and may be configured to receive a signal from a controller chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.