Lead-free solder alloy having reduced shrinkage cavities
US9227258B2 · kind B2 · utility
1Cited by
3References
14Claims
0Family size
Assignee
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Key dates
| Filing date | Apr 23, 2009 |
| Grant date | Jan 5, 2016 |
| Priority date | — |
| Expiry date | Apr 23, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A lead-free solder alloy having improved surface properties which suppresses minute irregularities and shrinkage cavities has a composition consisting essentially of Ag: 0.1-1.5%, Bi: 2.5-5.0%, Cu: 0.5-1.0%, optionally Ni: 0.015-0.035% and/or at least one of Ge and Ga: 0.0005-0.01%, and a remainder of Sn and unavoidable impurities.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.