Wafer level packaged infrared (IR) focal plane array (FPA) with evanescent wave coupling
US9227839B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 6, 2014 |
| Grant date | Jan 5, 2016 |
| Priority date | — |
| Expiry date | Jul 24, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B2201/0207
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A structure for detecting electromagnetic radiation having a predetermined wavelength. The structure includes a device wafer having a sensing element disposed on a predetermined region of a surface of the device wafer responsive to the electromagnetic radiation. A cover wafer is provided having a region thereof transparent to the electromagnetic radiation for passing the electromagnetic radiation through the transparent region onto a surface of the sensing element. A bond gap spacer structure is provided for supporting the surface of the sensing element from an opposing surface of the transparent region of the cover wafer a distance less than a fraction of the predetermined wavelength when the cover wafer is bonded to the device wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.