Thermoelectric cooling packages and thermal management methods thereof
US9228763B2 · kind B2 · utility
11Cited by
10References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 3, 2012 |
| Grant date | Jan 5, 2016 |
| Priority date | — |
| Expiry date | Oct 22, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/12044
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided are thermoelectric cooling packages and thermal management methods thereof. The method may include measuring a temperature of the thermoelectric cooling package including a semiconductor chip and a thermoelectric cooler, comparing the temperature of the thermoelectric cooling package with a target temperature, operating the thermoelectric cooler when the temperature of the thermoelectric cooling package is higher than the target temperature, and stopping the operation of the thermoelectric cooler when the temperature of the thermoelectric cooling package becomes lower than the target temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.