Package substrate with band stop filter and semiconductor package including the same
US9231286B2 · kind B2 · utility
0Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 23, 2013 |
| Grant date | Jan 5, 2016 |
| Priority date | — |
| Expiry date | Apr 10, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09781
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
According to one embodiment, a semiconductor package includes a band stop filter, which includes: a transmission line pattern arranged on a package substrate; and a conductive stub pattern arranged along the transmission line pattern in a state of being separated from the transmission line pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.