Patent · US Active

Non-uniform substrate stackup

US9232639B2 · kind B2 · utility

2Cited by

1References

16Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Zhichao Zhang · Chandler, US
Tao Wu · Chandler, US
Zhiguo Qian · Chandler, US
Kemal Aygun · Tempe, US

Key dates

Filing date	Dec 6, 2012
Grant date	Jan 5, 2016
Priority date	—
Expiry date	Sep 21, 2033

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49155
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Some embodiments described herein include apparatuses and methods of forming such apparatuses. One such embodiment may include a routing arrangement having pads to be coupled to a semiconductor die, with a first trace coupled to a first pad among the pads, and a second trace coupled to a second pad among the pads. The first and second traces may have different thicknesses. Other embodiments including additional apparatuses and methods are described.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.