Inventor · Chandler, AZ, US

Tao Wu

29Patents
6h-index
34Co-inventors
65Inventor score

Filing activity: Oct 1, 2009 → Nov 16, 2021

Most-cited inventions

PatentTitleAreaCited byStatus
US8127979B1 Electrolytic depositon and via filling in coreless substrate processing Electricity 25 Active
US8461036B2 Multiple surface finishes for microelectronic package substrates Emerging Cross-Sectional Technologies 23 Active
US9488483B2 Localization using road markings Physics 17 Active
US8643184B1 Crosstalk polarity reversal and cancellation through substrate material tuning Electricity 14 Active
US9704735B2 Dual side solder resist layers for coreless packages and packages with an embedded interconnect bridge and their methods of fabrication Electricity 13 Active
US10440668B1 Vehicle platooning management and power control with LTE/5G V2X communications Electricity 11 Active
US8615093B2 Apparatus and method for processing audio signal Electricity 5 Active
US9806011B2 Non-uniform substrate stackup Electricity 5 Active
US10629469B2 Solder resist layers for coreless packages and methods of fabrication Electricity 3 Active
US9053372B2 Road marking detection and recognition Physics 3 Active
US10433421B2 Reduced capacitance land pad Emerging Cross-Sectional Technologies 2 Active
US9232639B2 Non-uniform substrate stackup Emerging Cross-Sectional Technologies 2 Active
US11206513B1 Vehicle density over the air update scheduling Electricity 2 Active
US9299602B2 Enabling package-on-package (PoP) pad surface finishes on bumpless build-up layer (BBUL) package Electricity 1 Active
US11443970B2 Methods of forming a package substrate Electricity 1 Active
US11217866B2 Battery module for improving safety Emerging Cross-Sectional Technologies 0 Active
US10923943B2 Battery powered device with pre-powered circuit Emerging Cross-Sectional Technologies 0 Active
US11516915B2 Reduced capacitance land pad Emerging Cross-Sectional Technologies 0 Active
US9564407B2 Crosstalk polarity reversal and cancellation through substrate material Electricity 0 Active
US9391018B2 Crosstalk polarity reversal and cancellation through substrate material tuning Electricity 0 Active
US9607937B2 Pin grid interposer Electricity 0 Active
US9093313B2 Device packaging with substrates having embedded lines and metal defined pads Electricity 0 Active
US9355952B2 Device packaging with substrates having embedded lines and metal defined pads Electricity 0 Active
US9461679B2 System, method, and apparatus for analog signal conditioning of high-speed data streams Electricity 0 Active
US9331017B2 Chip package incorporating interfacial adhesion through conductor sputtering Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.