Semiconductor device including embedded controller die and method of making same
US9236368B2 · kind B2 · utility
0Cited by
4References
22Claims
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Assignee
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Key dates
| Filing date | Jan 28, 2013 |
| Grant date | Jan 12, 2016 |
| Priority date | — |
| Expiry date | Jan 28, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a substrate (102) with a cavity (112) formed therein for receiving a semiconductor die. In examples, the semiconductor die is a controller die (114). The controller die (114) may be electrically connected to the substrate (102) with electrical traces (120) which may be formed for example by printing. After the controller die (114) is electrically connected to the substrate (102), one or more memory die (150) may be affixed to the substrate (102), over the cavity (112) and controller die (114).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.