Inventor · Madison, WI, US

Cheeman Yu

25Patents
4h-index
35Co-inventors
55Inventor score

Filing activity: Jun 22, 2009 → Feb 25, 2016

Most-cited inventions

PatentTitleAreaCited byStatus
US8415808B2 Semiconductor device with die stack arrangement including staggered die and efficient wire bonding Electricity 16 Active
US9704797B2 Waterfall wire bonding Electricity 8 Active
US8053276B2 Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages Emerging Cross-Sectional Technologies 6 Active
US9240393B2 High yield semiconductor device Electricity 5 Active
US9773766B2 Semiconductor device including independent film layer for embedding and/or spacing semiconductor die Electricity 4 Active
US9337153B2 EMI shielding and thermal dissipation for semiconductor device Electricity 3 Active
US8053880B2 Stacked, interconnected semiconductor package Electricity 3 Active
US8878368B2 Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging Electricity 2 Active
US10229886B2 Discrete component backward traceability and semiconductor device forward traceability Electricity 2 Active
US8129272B2 Hidden plating traces Electricity 2 Active
US8853863B2 Semiconductor device with die stack arrangement including staggered die and efficient wire bonding Electricity 1 Active
US9230919B2 Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging Electricity 1 Active
US9331045B2 Semiconductor die laminating device with independent drives Electricity 1 Active
US8502375B2 Corrugated die edge for stacked die semiconductor package Electricity 1 Active
US8110439B2 Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages Emerging Cross-Sectional Technologies 1 Active
US8217522B2 Printed circuit board with coextensive electrical connectors and contact pad areas Emerging Cross-Sectional Technologies 0 Active
US8482139B2 Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards Electricity 0 Active
US7939944B2 Semiconductor die having a redistribution layer Electricity 0 Active
US8653653B2 High density three dimensional semiconductor die package Electricity 0 Active
US9362244B2 Wire tail connector for a semiconductor device Electricity 0 Active
US8232145B2 Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards Electricity 0 Active
US9209159B2 Hidden plating traces Electricity 0 Active
US8349655B2 Method of fabricating a two-sided die in a four-sided leadframe based package Electricity 0 Active
US10051733B2 Printed circuit board with coextensive electrical connectors and contact pad areas Emerging Cross-Sectional Technologies 0 Active
US9236368B2 Semiconductor device including embedded controller die and method of making same Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.