Substrate processing scrubber, substrate processing apparatus and substrate processing method
US9238256B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 6, 2013 |
| Grant date | Jan 19, 2016 |
| Priority date | — |
| Expiry date | Aug 21, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67051
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A removal target can be effectively removed from a substrate. In a substrate processing apparatus 1 and a substrate processing method by using a substrate processing scrubber 29 of removing the removal target from the substrate 5, the substrate processing scrubber 29 includes a base 31 connected to a rotation shaft 28; scrubber main bodies 32 provided at the base 31 and arranged at a regular distance in a rotational direction of the base 31; and a processing liquid supply opening 36 formed at the base 31 and configured to supply a processing liquid to the scrubber main bodies 32. Further, an area of an attachment surface of each of the scrubber main bodies 32 to be attached to the base 31 is larger than an area of a contact surface of each of the scrubber main bodies 32 to be brought into contact with the substrate 5.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.