Polishing pad having porogens with liquid filler
US9238294B2 · kind B2 · utility
1Cited by
14References
65Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 18, 2014 |
| Grant date | Jan 19, 2016 |
| Priority date | — |
| Expiry date | Jul 5, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D3/32
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Polishing pads having porogens with liquid filler and methods of fabricating polishing pads having porogens with liquid filler are described. In an example, a polishing pad for polishing a substrate includes a polishing body having a polymer matrix and a plurality of porogens dispersed throughout the polymer matrix. Each of the plurality of porogens has a shell with a liquid filler. The liquid filler has a boiling point less than 100 degrees Celsius at a pressure of 1 atm, a density less than water, or both.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.