High yield semiconductor device
US9240393B2 · kind B2 · utility
5Cited by
1References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 1, 2014 |
| Grant date | Jan 19, 2016 |
| Priority date | — |
| Expiry date | Aug 1, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device including two or more die stacks mounted to a substrate. The first die stack is mounted, at least partially encapsulated, and then tested. If the first die stack functions within predefined parameters, a second die stack is mounted on the first die stack, and then the device may undergo a second encapsulation process. Testing the first die stack before mounting the second improves yield by identifying faulty semiconductor die before all die are mounted within the semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.