Cooling structure, vortex-flow forming plate molding apparatus, and method for molding vortex-flow generating portion
US9243855B2 · kind B2 · utility
2Cited by
8References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 15, 2013 |
| Grant date | Jan 26, 2016 |
| Priority date | — |
| Expiry date | Mar 15, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49316
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A cooling structure for cooling a heat generating element allows cooling fluid to circulate around the heat generating element or a base material with the heat generating element disposed thereon. The cooling structure is provided with a vortex-flow generating portion which extends in a direction intersecting a circulation direction of the cooling fluid, and which generates a vortex flow depending on the flow rate of cooling fluid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.