Patent · US Active

Apparatus and method of applying a film to a semiconductor wafer and method of processing a semiconductor wafer

US9245765B2 · kind B2 · utility

1Cited by
17References
11Claims
0Family size

Assignee

Inventor

Key dates

Filing dateOct 14, 2010
Grant dateJan 26, 2016
Priority date—
Expiry dateDec 1, 2031

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T156/12
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

Implementations and techniques for applying a film to a semiconductor wafer and for processing a semiconductor wafer are generally disclosed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.