Apparatus of manufacturing semiconductor packages and methods of manufacturing semiconductor packages using the same
US9245787B2 · kind B2 · utility
6Cited by
27References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 13, 2012 |
| Grant date | Jan 26, 2016 |
| Priority date | — |
| Expiry date | Oct 21, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T279/11
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Apparatuses of manufacturing semiconductor packages are provided. An apparatus includes a chuck having a body, a porous plate disposed on the body, and a buffer pad disposed on the plate to provide a place on which a plurality of chips are loaded. The buffer pad has elasticity greater than the plate. The apparatus also includes a vacuum part supplying vacuum to the chuck so that the plurality of chips are sucked onto the buffer pad. Methods of manufacturing semiconductor packages using the apparatus are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.