Semiconductor device package with integrated antenna for wireless applications
US9245858B2 · kind B2 · utility
4Cited by
2References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 21, 2011 |
| Grant date | Jan 26, 2016 |
| Priority date | — |
| Expiry date | Jun 25, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device package is provided with integrated antenna for wireless applications. The semiconductor device package comprises a substrate including a semiconductor chip mounted thereon; a protective layer covering the semiconductor chip; a metal pattern mounted on the protective layer; and a first connective member connecting the semiconductor chip and the metal pattern. According to this configuration, the semiconductor device package is capable of being easily manufactured while minimizing the electrical distance between the metal pattern for use as an antenna and the semiconductor chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.