Semiconductor packaging apparatus formed from semiconductor package including first and second solder balls having different heights
US9245863B2 · kind B2 · utility
1Cited by
5References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 16, 2013 |
| Grant date | Jan 26, 2016 |
| Priority date | — |
| Expiry date | Aug 24, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
According to example embodiments of inventive concepts, a semiconductor package apparatus includes a first semiconductor package including a first substrate, a first solder resist layer on the first substrate, and a first sealing member that covers and protects the first solder resist layer, and a plurality of solder balls on the first substrate. The plurality of solder balls includes a first solder ball having a first height and a second solder ball having a second height that is different from the first height. The first sealing member includes holes that expose the solder balls.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.