Method and device of MEMS process control monitoring and packaged MEMS with different cavity pressures
US9249012B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 22, 2014 |
| Grant date | Feb 2, 2016 |
| Priority date | — |
| Expiry date | Oct 22, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B2201/0242
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method for fabricating an integrated MEMS device and the resulting structure therefore. A control process monitor comprising a MEMS membrane cover can be provided within an integrated CMOS-MEMS package to monitor package leaking or outgassing. The MEMS membrane cover can separate an upper cavity region subject to leaking from a lower cavity subject to outgassing. Differential changes in pressure between these cavities can be detecting by monitoring the deflection of the membrane cover via a plurality of displacement sensors. An integrated MEMS device can be fabricated with a first and second MEMS device configured with a first and second MEMS cavity, respectively. The separate cavities can be formed via etching a capping structure to configure each cavity with a separate cavity volume. By utilizing an outgassing characteristic of a CMOS layer within the integrated MEMS device, the first and second MEMS cavities can be configured with different cavity pressures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.