Pattern forming method and actinic ray-sensitive or radiation-sensitive resin composition for use in the method
US9250519B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 23, 2014 |
| Grant date | Feb 2, 2016 |
| Priority date | — |
| Expiry date | Dec 23, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/325
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The pattern forming method of the present invention includes: (i) forming a film including an actinic ray-sensitive or radiation-sensitive resin composition containing a compound (A) represented by General Formula (I) shown below; a resin (P) capable of decreasing solubility with respect to a developer including organic solvent by the action of an acid; and a compound (B) capable of generating an acid by irradiation of actinic rays or radiation; (ii) irradiating the film with actinic rays or radiation; (iii) developing the film irradiated with the actinic rays or radiation using a developer including an organic solvent.[Chem. 1]RN-A−X+ (I)
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.