Mechanisms for forming package structure
US9252065B2 · kind B2 · utility
17Cited by
2References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 22, 2013 |
| Grant date | Feb 2, 2016 |
| Priority date | — |
| Expiry date | Feb 1, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In accordance with some embodiments, a package structure and a method for forming a package structure are provided. The package structure includes a semiconductor die and a molding compound partially or completely encapsulating the semiconductor die. The package structure also includes a through package via in the molding compound. The package structure further includes an interfacial layer between the through package via and the molding compound. The interfacial layer includes an insulating material and is in direct contact with the molding compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.