Patent · US Active

Package vias for radio frequency antenna connections

US9252077B2 · kind B2 · utility

22Cited by

10References

17Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Wolfgang Molzer · Ottobrunn, DE
Edmund Goetz · Dachau, DE
Reinhard Mahnkopf · Oberhaching, DE
Bernd Memmler · Riemerling, DE

Key dates

Filing date	Sep 25, 2013
Grant date	Feb 2, 2016
Priority date	—
Expiry date	Sep 25, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3025
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Via are described for radio frequency antenna connections related to a package. In one example, a package has a package substrate, a die attached to the package substrate, and a conductive via from the package substrate to an external surface of the package to make a radio frequency connection between the antenna and the package substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.