Inventor · Ottobrunn, DE

Wolfgang Molzer

10Patents

3h-index

27Co-inventors

60Inventor score

Filing activity: Jul 22, 2002 → Dec 17, 2021

Most-cited inventions

Patent	Title	Area	Cited by	Status
US9252077B2	Package vias for radio frequency antenna connections	Electricity	22	Active
US9564400B2	Methods of forming stacked microelectronic dice embedded in a microelectronic substrate	Electricity	3	Active
US9209143B2	Die edge side connection	Electricity	3	Active
US6750483B2	Silicon-germanium bipolar transistor with optimized germanium profile	Electricity	3	Expired
US12431424B2	Buried power rails integrated with decoupling capacitance	Electricity	0	Active
US9583595B2	Methods of forming low noise semiconductor devices	Electricity	0	Active
US12057411B2	Stress relief die implementation	Electricity	0	Active
US10845073B2	Method and device for temperature control in a radio receiver	Physics	0	Active
US9171726B2	Low noise semiconductor devices	Electricity	0	Active
US9373588B2	Stacked microelectronic dice embedded in a microelectronic substrate	Electricity	0	Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.