Electronic fabric with incorporated chip and interconnect
US9253884B2 · kind B2 · utility
5Cited by
4References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 20, 2013 |
| Grant date | Feb 2, 2016 |
| Priority date | — |
| Expiry date | Feb 26, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/029
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A system comprises an article comprising one or more fabric layers, a plurality of electronic devices, each being incorporated into or onto one of the one or more fabric layers, and one or more communication links between two or more of the plurality of electronic devices. Each of the plurality of electronic devices can comprise a flexible substrate coupled to the fabric layer, one or more metallization layers deposited on the flexible substrate, and one or more electronic components electrically coupled to the one or more metallization layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.